Create something people would use and enjoy tomorrow.

The 3rd U.S.-China iHackathon is coming to the Valley! This year, with IBM, GitHub, Unity, Windows Azure and Canva dancing with us in the prize pool, we have packed a grand prize worth $5,000 value for the winning team. 

When: Friday, August 8th - Sunday, August 10th

Where: InnoSpring, 2901 Tasman Drive, Suite 107, Santa Clara, CA 95054

Who: Developers, UI&UX designers and founders who are looking to showcase their skills and network with serial entrepreneurs, influential investors and industry visionaries

Weekend Perks: Free wifi and free food for hackers

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If you have any questions about the event, please feel free to contact the InnoSpring team at info@innospring.net.

*You may go solo or team up with others. Team of up to 5 members are allowed.

 

View full rules

Eligibility

Participants must be physically present at InnoSpring (Santa Clara). 

You all start coding at the same time. You may prepare and work on your design, logo, wireframes, idea validation, digital mockups and user flows before the Hackathon. However, NO coding can be done beforehand, so that we can keep things fair.

Requirements

We encourage creative ideas including (but not limited to) O2O, software-hardware, cloud computing, and games.

You may go solo or team up with others. Team of up to 5 members are allowed.

You all start coding at the same time. NO coding can be done beforehand, so that we can keep things fair.

You will demo your product for 7 minutes followed by a 1-minute Q&A. Projects will be judged on their originality, creativity, viability, and technological difficulty. Don’t be scared if you didn’t finish… it’s okay as long as you tried your best.

 

Judges

Russ Glenn

Russ Glenn
Chief Strategist, InnoSpring

Shangpin Chang

Shangpin Chang
Co-Founder, CTO of DewMobile (Zapya)

Milind Karnik

Milind Karnik
President & Cofounder, Argil

Lennart Frantzell

Lennart Frantzell
IBM Cloud and Mobile Architect

Judging Criteria

  • Originality
  • Creativity
  • Viability
  • Technological Difficulty